The TechConnect 2017 Conference was held in Washington D.C. and co-locates with the largest global innovation program in physical and life sciences. The joint programs include the Nanotech 2017 Conference, theNational Innovation Summit and the National SBIR/STTR Conference.
On this event, the NSF Center for High-rate Nanomanufacturing not only had an Exhibit presentation but also Dr. Busnaina was invited as a speaker where he presented “Scalable Printing of Nano and Microscale Sensors and Electronics”. were he argue that Inkjet, screen-printing, and gravure are three printing technologies that are commercially used for printing electronics, flexible displays, and RFID tags. However, the smallest features that can be printed using inkjets today is about 20 microns, although this is still sufficient for many applications, its scale leaves it far behind today’s silicon electronics. We introduce the next generation of printed devices that prints feature at today’s silicon electronics line width, which is 1000 times smaller (about 20 nanometers). The technology uses directed assembly based printing at the nanoscale to make products that fully take advantage of the superior properties of nanomaterials. This printing technology can print metals, insulators, and semiconductors (including III-V and II-VI), organic and inorganic materials into micro and nanoscale structures and circuits on flexible and rigid substrates. The technology is 1000 times faster than inkjet-based printing and costs 10-100 times less than conventional fabrication. In this presentation, we show the applications of this technology in electronics, sensors and metamaterials applications.
For more information, please visit: https://www.techconnectworld.com