This center was supported by the National Science Foundation Award #EEC-0832785

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© 2017 Northeastern University

Prof. Busnaina at FLEX 2017: Printing of Nano and Microscale Electronics and Sensors.

 

Monterey, California held this year 2017 FLEX from Monday, June 19 to Thursday 22.

 

This event brings together world leaders in flexible and printed electronics in an environment conducive to formal and informal information exchange, networking, and business collaboration. The event attracts technical representatives from over 400 companies, universities, R&D labs, and government agencies from around the world.

 

In this event, Dr. Busnaina was invited as a speaker for Session 25: Emerging capabilities, on Thursday, June 22 from 1:40 pm to 2:00

 

An abstract of his presentation below. 

 

Printing of Nano and Microscale Electronics and Sensors

 

A new printing technology for printing of nano and microelectronics and Sensors on Flexible or Rigid Substrates has been developed. The new technology is capable of printing feature a 1000 times smaller (about 20 nanometers) than inkjet. This printing technology can print inorganic or organic conductors, semiconductors (including III-V and II-VI), and dielectrics. The technology uses minimum energy and water compared to conventional electronics nanofabrication. The technology is capable of printing 1000 times faster than inkjet, 1000 times smaller patterns and costs 10-100 times less than conventional fabrication. This presentation will show the applications of this technology in printing electronics and sensor applications. The presentation will also show the second-generation fully automated robotic printer that will include built-in inspection and annealing modules in addition to a registration and alignment module. Nano OPS strategic partner Mialra, Inc. designs and builds the automated modules, robots, and the alignment module.

 

(Source: Flex2017)

 

For more information about this event, visit http://www.semi.org/en/2017-flex

 

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